帮个忙句子太难了

forming a film on the rear surface
晶片外表面表面镀膜

wrong translation

在研磨晶片后表面的同时，保持绑缚有环状保护元件的晶片外表面位于研磨设备的卡盘台上。

\"同时”关系搞反了。

nigerose wrote:
在研磨晶片后表面的同时，保持绑缚有环状保护元件的晶片外表面位于研磨设备的卡盘台上。

\"同时”关系搞反了。

确实是高手，以后多向您请教！
我的MSN：bjlanglawyer@hotmail.com

jjove wrote:
1。to which，定语从句，the wafer to which the annular protective member is bonded
2。to，从the rear surface of the wafer到the outer surface of the wafer的a film

谈主，还是去掉这只小手吧。

我的两种解释度是有问题的，1就不用再啰嗦了，2我起初还怀疑原文上了一个to
真是惭愧呀

试译一下，供大家参考批评：

grinding the rear surface of the wafer while retaining the outer surface of the wafer to which
the annular protective member is bonded on a chuck table of a grinding device, after the rear surface grinding step is carried out, a step of forming a film on the rear surface of the wafer to
the outer surface of which the annular protective member is bonded, and a step of conducting a probe test on the devices are carried out

将环形保护元件粘贴在晶片的外表面上，在将所述晶片的外表面保持在研磨设备工作夹台上的同时对所述晶片的后表面进行研磨，在该后表面的研磨步骤之后，执行在所述晶片后表面及粘贴有环形保护元件的所述外表面上形成薄膜的步骤和对所述设备进行探针测试的步骤。