试译一下,供大家参考批评:
grinding the rear surface of the wafer while retaining the outer surface of the wafer to which
the annular protective member is bonded on a chuck table of a grinding device, after the rear surface grinding step is carried out, a step of forming a film on the rear surface of the wafer to
the outer surface of which the annular protective member is bonded, and a step of conducting a probe test on the devices are carried out
将环形保护元件粘贴在晶片的外表面上,在将所述晶片的外表面保持在研磨设备工作夹台上的同时对所述晶片的后表面进行研磨,在该后表面的研磨步骤之后,执行在所述晶片后表面及粘贴有环形保护元件的所述外表面上形成薄膜的步骤和对所述设备进行探针测试的步骤。 |